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Heat Transfer Design Project HOT Gantry Crane - Research Paper Example

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The design will apply the heat sink technology. The system experience a temperature of 150 degrees at peak operation condition and thus this design will be able…
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Heat Transfer Design Project HOT Gantry Crane
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Heat Transfer Design Project HOT Gantry Crane

Download file to see previous pages... In the current setup of the electronics package, the heat generated by the transistors can only be lost through air convection. The temperature of the devicessurrounding, therefore, needs to be less than the allowable temperature of the device. At 150 degrees Celsius, the device is prone to damage. The introduced heat sink will however try to reduce the junction temperature for the device and ‘dump’ it in the surrounding media. Electronic device uses air as a medium.In a transistor; there exist connections between the casing and the junction and from the case to theheat sink. In addition, the contacts between the device and the sink usually contain a thin film, which, therefore, affects the heat transfer. All these features cause a temperature differential. They act as thermal resistances and usually each thermal resistance has a coefficient number always unique for each case and is expressed in temperature per watt. Because of this, there develops temperature differences between the collector junction and the ambient. This particular variable should however be kept at a minimum
1) Rearranging the transistors- In the current layout, the transistors are stacked together. This contributes to theaccumulationon heat thus increase in temperature. This proposed design will consider arranging the transistor and having some gap between them. The spacing ensures free circulation of air and heat loss from the transistor surfaces.
The material commonly used for heat sinks is aluminium with some fins fitted for more effective heat dissipation. The fins increase the surface area over which heat dissipation takes place.Since thecostis a major factor; the ultimate choice for this design will be aluminium.
The sink chosen have should have a flat surface to enhance good physical contact. This will ensure maximum heat transfer. Grooves that match the transistors contact will be createdon the heat sink block.
The heat sink will be fixed together with a ...Download file to see next pagesRead More
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